中国科学技术大学自旋电子材料与器件实验室--自旋电子材料与器件实验室-- C. Tang, L. Alahmed, P. Li*, et al., Effects of temperature and structural geometries on a skyrmion logic gate,.IEEE Transactions on Electron Devices,2021,69(4):1706

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C. Tang, L. Alahmed, P. Li*, et al., Effects of temperature and structural geometries on a skyrmion logic gate,.IEEE Transactions on Electron Devices,2021,69(4):1706 - 1712.

发布时间：2024-04-23点击次数：

DOI码：
10.1109/TED.2021.3130217
发表刊物：
IEEE Transactions on Electron Devices
摘要：
We design a skyrmion-magnetic domain interconversion logic gate (SkyMDILogic) gate and use it as a model system to study the geometrical and thermal effects. We particularly focus on the effects of temperature and structural defects. Micromagnetic simulations are used to study the skyrmion movement and characterize the relevant properties. We also construct an equivalent circuit model to calculate the energy consumption and logic operations at different temperatures. We find that temperature significantly affects the stability of a skyrmion. At elevated temperatures, the skyrmion propagation is more robust against the pinning effect of structural defects. Our results highlight the effects of thermal and structural defects, which remained largely unexplored in previous logic gate designs.
论文类型：
期刊论文
卷号：
69
期号：
4
页面范围：
1706-1712
是否译文：
否
发表时间：
2021-12-10

上一条：Riddiford L J, Grutter A J, Pillsbury T, et al. Understanding signatures of emergent magnetism in topological insulator/ferrite bilayers[J]. Physical review letters, 2022, 128(12): 126802. 下一条：Z. Zhou, U. Guin, P. Li*, and V. D. Agrawal, Fault modeling and test generation for technology-specific defects of skyrmion logic circuits.2022 IEEE 40th VLSI Test Symposium (VTS),2021,